ขาย ☂SS-T12A X3 for iPhone 6 7 8 X XS XSMAX Motherboard Layered Face ID Heating Platform CPU Middle level Mainboard Desolde ราคาที่ดีที่สุด

SS-T12A X3 for iPhone 6 7 8  X XS XSMAX Motherboard Layered Face ID Heating Platform CPU Middle level Mainboard Desoldering Kit Description: SS-T12A Heating Station with different iphone Motherboard Heating groove, T12A-X T12A-XS T12A-XSM  iphone X XS MAX Double Layers Board Pre-heating Rework Station, iphone 5S 6 7 motherboard desoldering station, SS-T12A Heating Station for iphone 6 7 8 X XS MAX motherboard desoldering repair. 1pcs SS-T12A Heating Station Main Unit come with T12A-X3 / T12A-CPU / T12A-F/ T12A-Face ID/ T12-andriod Motherboard Heating groove SS-T12A Heating Station Main Unit + Five kinds Motherboard Heating groove: T12A-X3 for X / XS / XMAX T12A-CPU T12A-F T12A-Andriod T12A-Face ID  SUNSHINE SS-T12A iPhone X upper / lower motherboard pre-heating station adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. SS-T12A has dual bayonet design to make iphone X motherboard stable. SUNSHINE SS-T12A has EU, AU, and US plug, 110V or 220V for your choice. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear 100V-240V SS-T12A iPhone X mainboard stratified 185 degrees accurate rapid separated disassembly heating station iPhone X logic board was folded in half, two layers then were soldered together, the upper layer is the mainboard, and the lower layer is the signal board. Which made our repair much difficult to proceed, how to repair iPhone X logic board in fast and efficient method, need the professional iPhone X motherboard repair tools Features 1. Adopting 185-degree layered process to remove the IP-X motherboard, not only from our fine analysis of IP-X solder paste ,but  depends on the special heating design and precise temperature control of SS-T12A. 2. SS-T12A only heats the area that the IP-X board needs to be removed to prevent improper heating. 3. Dual bayonet design, make sure the IP-X motherboard is stable on the stage. 4. High purity copper is used as a film to ensure uniform heat transfer and heat.